Modular Footprint
Modular footprint of one, two, and four kit configurations of the U.S. Army Engineer Research and Development Center’s Modular Assembly Shelter Kits. ERDC’s Justine Yu and Tanner Wood were awarded a patent for the design.

Download Image: Full Size (0.08 MB)
Tags:
Photo by: US Army Rendering |  VIRIN: 200515-A-ZZ999-002.JPG